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”Ό“±‘ΜŽY‹Ζ•ͺ–μ‚ΜŽε—v’ρŒgζ

’ρŒg‰οŽΠ
Žε‘Μ‚Ζ‚·‚ιŽY‹Ζ
Ž–‹Ζ“ΰ—e
”Ό“±‘̐»‘’‘•’u
@œ’ŠE‚Μ”Ό“±‘̐»‘’‘•’uŽsκ(CMM)
@œCritical Subs‚™tems
@œŒŽ•Κ”Ό“±‘ΜŽsκ—\‘ͺ(IP Pro)
@œŒΪ‹q–ž‘«“x’²Έ(CSR)
ƒfƒBƒoƒCƒX•‰ž—p•ͺ–μ
@œDevice ( ASIC,Memory,Logic etc)
@œSemiconductor Munufacturing
@@(Package,Foundry,etc)
@œEnd-Use@Market ( 65‚ΜApplicationj
DRAM,Flash
@œŒŽ•Κ‰ž—p•ͺ–μ•ΚDRAMŽsκ,‰ΏŠi•ͺΝƒf[ƒ^
@@¨ PC
@@¨ Non-PC
@œŒŽ•Κ‰ž—p•ͺ–μ•ΚFlashŽsκ,‰ΏŠi•ͺΝƒf[ƒ^
@@¨ Žε—v‰ž—p•ͺ–μ•Κ•ͺΝ


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